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Edge Card / Micro Backplane — All Samtec

Micro Backplane Systems

Edge Rate™

Rugged, High Speed

  • Performance: Up to 10.5 GHz / 21 Gbps
  • Rugged Edge Rate™ contacts
  • Contact designed for high speed applications
  • Smooth, milled, mating surface

High Speed Edge Card

Rugged, Micro Backplane Systems

  • Performance: Up to 18.5 GHz / 37 Gbps
  • Rugged Edge Rate™ contacts
  • Card slot: 1,60 mm (.062″)
  • Single-ended and differential pairs
  • Vertical, right angle, edge mount

Micro Edge Card Systems

Micro Backplane Systems

  • Performance: Up to 14.5 GHz / 29 Gbps
  • Solutions for .031″ (0,80 mm), .062″ (1,60 mm), and .093″ (2,40 mm) thick cards
  • Vertical, right angle, edge mount

Q Rate®

Slim, Rugged High Speed Interconnects

  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate™ contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim Footprint (less than 5mm wide)

Q Strip®

High Speed Interconnects

  • Performance: Up to 9.0 GHz / 18 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Contacts: Up to 200 I/Os

Q2™

Rugged/High Speed

  • Performance: Up to 8.0 GHz / 16 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available

SEARAY™

High Speed, High Density Arrays

  • Performance: Up to 9.5 GHz / 19 Gbps
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs typical array products

High Speed Card Systems

High Density Edge Card

High Speed Edge Card Systems

  • Staggered contacts for effect 0,5mm pitch
  • Bi-level mating (2 mating stages)
  • 4 rows of contacts
  • Saves PCB real estate

High Speed Edge Card (0,80 mm)

High Speed Card Systems

  • Performance: Up to 18.5 GHz / 37 Gbps
  • Rugged Edge Rate™ contacts
  • Card slot: 1,60 mm (.062″)
  • Single-ended and differential pairs

Micro Edge Card Systems

High Speed Card Systems

  • Performance: Up to 14.5 GHz / 29 Gbps
  • Vertical and right angle orientations
  • Alignment pins
  • Surface mount
  • Contacts: Up to 140 I/Os

Micro TCA Connectors

High Speed Card Systems

  • Performance: Up to 12.0 GHz/24 Gbps
  • Compliant to µTCA™ standard architecture
  • Form/fit/function compatibility with Molex

Mini Card Guide Systems

Micro Card Systems

  • Available with or without card guides
  • Various plating options
  • Contacts: Up to 50 I/Os
  • Card Slot: .8mm (.0315”), 1,60mm (.062”)

PCI Express®

PCI Express® Systems

  • PCI Express® compatible system
  • Supports 1, 4, 8 and 16 PCI Express® links
  • Vertical or right angle PCB mount and card edge mount

Serial ATA

Link Card Socket

  • Tremendous board stacking, routing flexibility
  • Mount in pairs onsame side or opposite side for easy routing
  • SATALink™ compatible

SFP, SFP+

Transceiver Socket, Cage

  • Mates with SFP, SFP+, XFP, or ZENPAK transceivers
  • Connectors and cage available
  • 20, 30, or 70 I/Os

MSA Transceiver Interfaces

SFP

Transceiver Cage and Socket

  • Mates with SFP, SFP+, XFP, or NENPAK transceivers
  • Connectors and cage available
  • 20, 30, or 70 I/Os

PCI Express® Interfaces

PCI Express®

PCI Express® Systems

  • PCI Express® compatible system
  • Supports 1, 4, 8 and 16 PCI Express® links
  • Vertical or right angle PCB mount and card edge mount