High Speed Board to Board — All Samtec
Mezzanine
Q Strip ®
High Speed Interconnects
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Contacts: Up to 180 I/Os
Q Pairs ®
Differential Pair Interconnects
- Performance: Up to 10.5 GHz / 21 Gbps
- Optimized for 100 Ohm systems
- Integral ground/power plane
- Stack Height: 5-25mm
- Contacts: Up to 100 pairs
Q Rate ®
Slim, Rugged High Speed Interconnects
- Performance: Up to 15 GHz / 30 Gbps
- Rugged Edge Rate™ contacts
- Integral ground/power plane
- Up to 156 positions
- Slim Footprint (less than 5mm wide)
Q2™
Rugged/High Speed Interconnects
- Performance: Up to 8.5 GHz / 17 Gbps
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
Edge Rate™
Rugged/High Speed Interconnects
- Performance: Up to 20 GHz / 40 Gbps
- Rugged Edge Rate™ contacts
- Contact designed for high speed applications
- Smooth, milled, mating surface
Razor Beam™
High Speed/High Density Interconnects
- 10 stack height options from 5,00 mm to 12,00 mm
- Audible click when mated
- Up to 100 contacts
Rugged High Speed Strips
Q2™
Rugged, High Speed Interconnects
- Performance: Up to 8.0 GHz / 16 Gbps
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
Edge Rate™
Rugged, High Speed Interconnects
- Edge Rate™ contacts optimized for signal integrity performance
- Robust when «zippered» during unmating
- 0,80 mm or 0,50 mm pitch systems
Q Rate®
Slim Body High Speed Micro Rugged Strips
- Slim 5,00 mm body width with 0,80 mm micro pitch
- Integral ground/power plane
- Increased contact wipe for rugged applications
Razor Beam™
High Speed/High Density Interconnects
- 10 stack height options from 5,00 mm to 12,00 mm
- Audible click when mated
- Up to 100 contacts
Floating Contact System
Micro Rugged, High Speed Connector Strips
- Provides 0,50 mm (.0197″) float in X and Y directions
- Ideal for multiple connectors on a board
- Up to 60 floating contacts
High Density Arrays
SEARAY™
High Density Open Pin Field Arrays
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- Performance up to 18 GHz/pair
SEARAY™ 0,80 mm
Ultra High Density Open Pin Field Arrays
- Performance up to 6 GHz
- 20, 26 or 30 AWG cables
- Wide variety of mix-and-match cable terminations
- Cable connector kits available
SEARAY™ LP
Low Profile Open Pin Field Arrays
- 4 mm, 4,5 mm, 5 mm stack heights
- Up to 180 I/Os
- 4 and 6 row designs
- .050″ (1,27 mm) pitch
- Dual beam contact system
DP Array®
Dedicated Differential Pair Arrays
- Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
- No return paths needed
- Fewer board layers required
HD Mezz
Elevated Open Pin Field Arrays
- Application specific capability to stack heights from 20 mm to 35 mm
- Open pin field design
- Performance: Up to 9 GHz / 18 Gbps
- 2,00 mm x 1,20 mm pitch
Ultra Low Profile Interposers
Compression / One Piece Arrays
- 1 mm, 1,75 mm and 3,10 mm standard heights
- Dual compression contacts
- 0,80 mm (.0315″), 1,00 mm (.0394″) or .050″ (1,27 mm) pitch grid
Ultra Micro
Razor Beam™ LP
Ultra Slim, Ultra Low Profile and Ultra Fine Pitch Interconnects
- Ultra fine pitch – 0,40 mm and 0,50 mm
- Ultra low stack down to 2,00 mm
- Slim body design for increased board space savings
Edge Rate™
Rugged, High Speed Interconnects
- Edge Rate™ contacts optimized for signal integrity performance
- Robust when «zippered» during unmating
- 0,80 mm or 0,50 mm pitch systems
Razor Beam™
High Speed/High Density Interconnects
- 10 stack height options from 5,00 mm to 12,00 mm
- Micro pitch: 0,50 mm, 0,635 mm, and 0,80 mm
- Audible click when mated
Ultra Low Profile Interposers
Compression / One Piece Arrays
- 1 mm, 1,75 mm and 3,10 mm standard heights
- Dual compression contacts
- 0,80 mm (.0315″), 1,00 mm (.0394″) or .050″ (1,27 mm) pitch grid
SEARAY™ 0,80 mm
Ultra High Density Open Pin Field Arrays
- 0,80 mm (.0315″) pitch grid
- 50% board space savings versus .050″ (1,27 mm) pitch SEARAY™
- Performance: Up to 17.5 GHz / 35 Gbps
- Rugged Edge Rate™ contact system
SEARAY™ LP
Low Profile Open Pin Field Arrays
- 4 mm, 4,5 mm, 5 mm stack heights
- Up to 180 I/Os
- 4 and 6 row designs
- .050″ (1,27 mm) pitch
- Dual beam contact system
High Isolation RF
IsoRate ®
Isolated Transmission Line Interconnects
- Performance: up to 10.5 GHz/21 Gbps
- 90% performance at 50% cost of traditional RF
- 50Ω and 75Ω board-to-board systems
- 4,00 mm (.1575″) pitch
Floating RF Systems
Board-to-Board RF Systems
- Compensates for misalignment in X & Y directions
- Frequency range (SMP): DC to 40 GHz
- Frequency range (AFI): DC to 6 GHz
Ganged Micro Scale
High Performance Systems
- 50Ω & 75Ω ganged micro RF systems
- 6,40 mm stack height on 5,00 mm pitch
- Right angle jacks available
- Optional threaded inserts for cable mating
28+ Gbps Solutions
28+ Gbps Solutions
High Speed Board-to-Board Systems
- 0,40 mm, 0,50 mm, 0,80 mm, 0,635 mm or .050″ pitch
- Pin counts from 10 to 500
- Stack heights from 4 mm to 30 mm
- Vertical and horizontal orientations